Core Trend: AI Data Centers Drive Cable Safety Upgrade

With NVIDIA GB200/AMD MI350 chips exceeding 1200W, cable channel temperatures in data centers reach 110℃+. 2025 NFPA 262 updates mandate:
  OFNP-rated cable Dsmax ≤50 (vs. ≤75 legacy)
  Flame spread ≤1.5m (UL 1685 Cat.5)
Per BCC Research, global flame-retardant PVC cable market for AI data centers will hit $4.2B in 2025, OFNP-grade demand growing at 35% CAGR.

Tech Breakthrough: Dual Charring-Suppression Mechanism

EP-Y011 Innovations (Patent CN202410356789.2)

1. Molybdate-Mg(OH)₂ Core-Shell Structure

   • 40% molybdate (smoke suppression) + 60% Mg(OH)₂ (flame retardancy)

   • Forms ceramic char layer at 250°C, OI=46% (ASTM D2863)

2. Record-Low Smoke Density

   Test Condition	Traditional Sb₂O₃	EP-Y011
   Flaming Dsmax (GB/T 8323)	320	176
   Non-flaming Dsmax (GB/T 8323)	480	222
   UL 1685 Flame Spread	2.8m	0.9m
   Source: Konnod Lab (2025Q3)

3. Electrical Performance Assurance

   • Volume resistivity >1×10¹⁵ Ω·cm (IEC 60093)

   • Dk=3.2 at 1MHz, compatible with 400G optical modules

Validation: Top-Tier AI Data Centers

Supply Chain Edge: Compliance & Cost

• Zero Hazardous Substances: Passed RoHS/REACH SVHC 239 tests (SGS-REA25-0886)

• Non-Migrating: Water solubility <5g/L (25°C), no long-term performance loss

• Cost Efficiency: 5phr loading (vs. 8-10phr traditional), 18% cable cost reduction

Future Expansion: Smart Manufacturing

10,000-ton Zhuhai plant (Q4 2025) features:
▶ Supercritical CO₂ drying: D50=1-4μm
▶ Moisture content ≤0.3% (industry avg. 1.2%)
▶ AI vision QC system (99.98% defect detection)